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The Thermal Grizzly TG Putty Advance 30g Thermal Pads offer a high-quality thermal interface option aimed at providing excellent heat dissipation and effective cooling for high-performance elements such as VRAM, VRMs, and chipset areas. Boasting an advanced putty formulation, this thermal pad substitute molds seamlessly to irregular surfaces and bridges tiny gaps, guaranteeing uniform contact and efficient heat dissipation. Simple to cut, mold, and apply, TG Putty Advance is perfect for gaming setups, overclocked machines, and professional workstations where keeping temperatures down is essential for stability and performance. Whether you're enhancing your cooling system or creating personalized thermal solutions, Thermal Grizzly TG Putty Advance 30g provides outstanding thermal conductivity, improved system performance, and enduring reliability—making it a preferred option for enthusiasts and builders who require superior thermal management
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